CXSD62117双通道电压模式和同步PWM控制器驱动双N通道mosfet两个通道均采用180度相移
发表时间:2020-04-24
浏览次数:140

目录36b嘉泰姆

1.产品概述                       2.产品特点36b嘉泰姆
3.应用范围                       4.下载产品资料PDF文档 36b嘉泰姆
5.产品封装图                     6.电路原理图                   36b嘉泰姆
7.功能概述                        8.相关产品

一,产品概述(General Description)         36b嘉泰姆
        The CXSD62117 is a dual channel voltage mode and syn-chronous36b嘉泰姆
PWM controller which drives dual N-channel MOSFETs. The two channels36b嘉泰姆
are operated with 180 de-gree phase shift.The device integrates all of the36b嘉泰姆
control, monitoring, and protecting functions into a single package; provides36b嘉泰姆
two controlled power output with over-voltage, over-temperature, and36b嘉泰姆
over-current protections.36b嘉泰姆
       The CXSD62117 provides excellent regulation for output load variation.36b嘉泰姆
The internal 1.0V temperature-compen- sated reference voltage provides36b嘉泰姆
high accuracy of 0.8% over line and temperature. The device includes a36b嘉泰姆
50kHz free-running triangle-wave oscillator that is adjustable from 50kHz36b嘉泰姆
to 400kHz.The CXSD62117 has been equipped with excellent pro-tection36b嘉泰姆
functions: POR, OCP, UVP, and OVP protections.The Power-On-Reset (POR)36b嘉泰姆
circuit can monitor the VCC and OCSET voltage to make sure the supply36b嘉泰姆
voltage ex-ceeds their threshold voltage while the controller is running. The36b嘉泰姆
Over-Current Protection (OCP) monitors the output current by using the36b嘉泰姆
voltage drop across the high side MOSFET’s RDS(ON). When the output36b嘉泰姆
current reaches the trip point, the controller will be latched. Under-Voltage36b嘉泰姆

Protection (UVP) and Over-Voltage Protection (OVP) moni-tor the FB36b嘉泰姆
voltage to protect CXSD62117 from burnout when output voltage is36b嘉泰姆
under 50% or over 120% of normal out-put voltage. The CXSD6211736b嘉泰姆
is available in SOP-20 package.36b嘉泰姆

二.产品特点(Features)36b嘉泰姆
Single 12V Power Supply Required36b嘉泰姆
Excellent Output Voltage Regulation36b嘉泰姆
- 1.0V±0.8% Internal Reference Over Line and Temperature36b嘉泰姆
Simple Single Loop Control Design36b嘉泰姆
- Voltage Mode PWM Control 0~100% Duty Ratio36b嘉泰姆
Programmable Frequency Range from 50kHz to36b嘉泰姆
400kHz (Constant 50kHz when Floating)36b嘉泰姆
Integrated Soft-Start and Soft-Off (Patent Pending)36b嘉泰姆
Support Pre-Biased Power-On36b嘉泰姆
Both Channel with 180o Phase Shift36b嘉泰姆
Integrated Boot-Strap Diode36b嘉泰姆
Over-Current Protection36b嘉泰姆
- Sense High Side MOSFET’s RDS(ON)36b嘉泰姆
120% Over-Voltage Protection36b嘉泰姆
50% Under-Voltage Protection36b嘉泰姆
Over-Temperature Protection36b嘉泰姆
Available in SOP-20 Package36b嘉泰姆
Lead Free and Green Devices Available (RoHS Compliant)36b嘉泰姆
三,应用范围 (Applications)36b嘉泰姆
SMPS36b嘉泰姆

四.下载产品资料PDF文档 36b嘉泰姆

需要详细的PDF规格书请扫一扫微信联系我们,还可以获得免费样品以及技术支持36b嘉泰姆

 QQ截图20160419174301.jpg36b嘉泰姆

 36b嘉泰姆

五,产品封装图 (Package)36b嘉泰姆

36b嘉泰姆

六.电路原理图36b嘉泰姆

blob.png36b嘉泰姆

七,功能概述36b嘉泰姆

Layout Consideration36b嘉泰姆
In any high switching frequency converter, a correct lay-out is important to ensure proper operation of the36b嘉泰姆
regulator. With power devices switching at 200kHz, the resulting current transient will cause voltage spike across the interconnecting impedance and parasitic circuit elements. As an example, consider the turn-off transition of the PWM MOSFET. Before turn-off, the MOSFET is car-rying the full load current. During turn-off, current stops flowing in the MOSFET and is free-wheeling by the lower MOSFET and parasitic diode. Any parasitic inductance of the circuit generates a large voltage spike during the switching interval. In general, using short and wide printed circuit traces should minimize interconnecting imped- ances and the magnitude of voltage spike. And signal and power grounds are to be kept separating till com-bined using the ground plane construction or single point grounding. Figure 8. illustrates the layout, with bold lines36b嘉泰姆
Layout Consideration (Cont.)36b嘉泰姆

indicating high current paths; these traces must be short and wide. Components along the bold lines should be36b嘉泰姆

placed lose together. Below is a checklist for your layout:- Keep the switching nodes (UGATE, LGATE, and PHASE)away from sensitive small signal nodes since these nodes are fast moving signals. Therefore, keep traces36b嘉泰姆
to these nodes as short as possible.36b嘉泰姆
- The traces from the gate drivers to the MOSFETs (UGATEand LGATE) should be short and wide.36b嘉泰姆

- Place the source of the high-side MOSFET and the drainof the low-side MOSFET as close as possible. Minimiz-ing the impedance with wide layout plane between the two pads reduces the voltage bounce of the node.36b嘉泰姆

- Decoupling capacitor, compensation component, the resistor dividers, and boot capacitors should be close36b嘉泰姆

their pins. (For example, place the decoupling ceramic capacitor near the drain of the high-side MOSFET as36b嘉泰姆
close as possible. The bulk capacitors are also placed near the drain).36b嘉泰姆
- The input capacitor should be near the drain of the up-per MOSFET; the output capacitor should be near the36b嘉泰姆
loads. The input capacitor GND should be close to the lower MOSFET GND.36b嘉泰姆
- The drain of the MOSFETs (VIN and PHASE nodes)should be a large plane for heat sinking.36b嘉泰姆
- The ROCSET resistance should be placed near the IC as close as possible.36b嘉泰姆
- The decoupling capacitor for VCC should be placed near the VCC and GND. CBOOT should be connected as36b嘉泰姆
close to the BOOT and PHASE pins as possible. 36b嘉泰姆

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